Conceptual Reference Database for Building Envelope Research |
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| Essay:Conference: International Particleboard/Composite Materials Symposium2001 Proceedings 35th international particleboard/composite materials symposium, Proceedings of the International Particleboard/Composite Materials Symposium. The proceedings contains 20 papers from the conference of 35th International Particleboard/Composite Materials Symposium. Topics discussed include: flexural properties of structural lumber products after long-term exposure to 150°F and 75% relative humidity; biodeterioration of wood-based composites and its prevention; long-term load effects for wood composites; lessons in durability from the Building Envelope Research Consortium (BERC) experience in British Columbia; wood-based panels with improved durability for laminate flooring applications; green blending to improve panel durability; and finite element modeling of dimensional stability in layered wood composites. |