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Related Concept
  • 2D HAM model: HAM: computer models
  • mold growth in TCCC2D: fungi: growth and growth model
  • computer codes for heat-air-moisture transfer



  • Related References
  • Survey
    Hens, H. and Janssens, A., (1993), Inquiry on HAMCAT codes
  • Kohonen, R., (1991), Modeling and calculating moisture transfer in building materials
  • use of TCC2D
    Ojanen, T., (1998), Improving the drying efficiency of timber frame walls in cold climates, by using exterior insulation
  • Ojanen, T., Salonvaara, M. and Simonson, C. J., (2002), Integration of simplified drying tests and numerical simulation in moisture performance analysis of the building envelope
  • Straube, J.F. and Burnett, E.F.P, (2001), Overview of hygrothermal (HAM) analysis methods




  • Essay:

    HAM: TCCC2D - Transient Coupled Convection and Concudtion in 2 Dimensions

    "A 2D transient HAM transfer, multilayer building structures, ordinary finite differnce method. Heat: conduction and convection, moisture: diffusion and convection

    Properties: dry density, thermal capatity, thermal conductivity, air an vapor permeability, sorption isotherms. Weather: hourly values of ambient temperature and relative humitiy, solar radiation intensities, and wind velocity and direction.

    Improved with a mold growth simulation


    Related Articles:





    CRDBER, at CBS, BCEE, ENCS, Concordia,